Abstract
The EMC and EMI of the IC packaging are becoming increasingly important to modern electronics. Its EMC, SI, and PI have been broadly attested. But electromagnetic radiations from IC packaging and the corresponding EMI were seldom studied. In this paper, the fundamental principles and properties of the electromagnetic radiations caused by vias and traces in IC packagings are carefully investigated. Various radiation mechanisms are analyzed for different representative scenarios. Numerical simulations are employed to support the analyzing results. © 2012 IEEE.
Recommended Citation
N. K. Huang et al., "Electromagnetic Emissions From The IC Packaging," 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012, pp. 65 - 68, article no. 6469426, Institute of Electrical and Electronics Engineers, Dec 2012.
The definitive version is available at https://doi.org/10.1109/EDAPS.2012.6469426
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
cavity modes; EMC/EMI; IC packaging; radiated emission; trace radiation; via radiation
International Standard Book Number (ISBN)
978-146731443-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2012
