Abstract
The IC packaging EMC/SI/PI problems have been broadly attested. But IC packaging EMI was seldom addressed. Because the EMI emission by IC packagings is increasingly significant, in this paper, EMI behaviors are systematically studied. To fundamentally understand the radiation mechanism, radiated contributions from ground lids, vias, and traces of the packaging are investigated and modeled separately. It is seen that the packaging EMI has clearly low frequency and high frequency behaviors. The low frequency behavior is due to the Hertzian dipole effects of vias. The high frequency behavior is due to the radiation of excited cavity modes. Both theoretical analysis based on first principles and simulated results based on the numerical full wave solver are provided to find out critical impact factors to IC packaging EMI. This work provides basic modeling components for comprehensive radiation studies in the future. It directly benefits fundamental understandings and guidelines for the optimal design of the packaging EMI reduction. © 2012 IEEE.
Recommended Citation
N. K. Huang et al., "Fundamental Components Of The IC Packaging Electromagnetic Interference (EMI) Analysis," 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, pp. 141 - 144, article no. 6457861, Institute of Electrical and Electronics Engineers, Dec 2012.
The definitive version is available at https://doi.org/10.1109/EPEPS.2012.6457861
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
EMI; ground lid; IC packaging; trace radiation; via radiation
International Standard Book Number (ISBN)
978-146732539-4
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2012
