Nonconformal Discretization of Higher Order vs. IE Method for Multiscale Electromagnetic Scattering
Abstract
In this work, the nonconformal discretization of volume surface integral equation (VSIE) method comprising surface integral equation (SIE) and volume current integral equation (VJIE) is developed for the calculation of electromagnetic scattering from composite objects with defective meshes. This VSIE allows the discretization of composite objects is non-conformal. That is achieved by introducing half basis functions in VSIE. Further, the nonconformal VSIE is discretized by higher order hierarchical vector (HOHV) basis functions. Because of the hierarchical property of theses HOHV bases, different basis orders based on different mesh sizes and high contrast dielectric medias can be chosen to reduce the matrix dimension and enhance the flexibility of geometrical modeling. Numerical examples of multiscale electromagnetic problems are shown to demonstrate the accuracy, flexibility and ability of the proposed method.
Recommended Citation
Q. Cai et al., "Nonconformal Discretization of Higher Order vs. IE Method for Multiscale Electromagnetic Scattering," Proceedings of the 5th IEEE International Conference on Computational Electromagnetics (2019, Shanghai, China), Institute of Electrical and Electronics Engineers (IEEE), Mar 2019.
The definitive version is available at https://doi.org/10.1109/COMPEM.2019.8779047
Meeting Name
5th IEEE International Conference on Computational Electromagnetics, ICCEM 2019 (2019: Mar. 20-22, Shanghai, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Higher Order Hierarchical Vector (HOHV) Basis Functions; Multiscale; Nonconformal; Volume Surface Integral Equation (VSIE)
International Standard Book Number (ISBN)
978-153867111-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Mar 2019
Comments
This work is supported by National Science Foundation of China (No.61801406), and Longshan Talent Fund of Southwest University of Science and Technology (No.18lzx677).