Far-End Crosstalk Mitigation in DDR5 using Graphene-Paraffin Material Coated Signal Lines with Tabs
Abstract
With improvement in high-density and high-speed printed circuit boards (PCBs), far-end crosstalk (FEXT) problem is one of most critical factors affecting signal quality. This is main because the spacing between adjacent signal lines becomes very small, such as the PCB routes in the fifth generation double data rate technology (DDR5). In this paper, a new method is developed for the mitigation of FEXT in DDR5. First, we investigate two cases, i.e., tabs added on the signal lines and graphene-paraffin materials coated signal lines with tabs. From the simulated S-parameters, the associated FEXT can be suppressed in a very wide frequency range (0∼16GHz). Then, graphene-paraffin material is added on signal lines with tabs to further improve the performance. The FEXT can be decreased more than 12dB around 3.2GHz, compared with the traditional signal routing. It has been demonstrated by the final results in both frequency and time domains that, our structure has succeeded in mitigating FEXT in DDR5, in comparison with previous techniques. Thus, this method has a great potential in FEXT mitigation in DDR5.
Recommended Citation
Q. Cai et al., "Far-End Crosstalk Mitigation in DDR5 using Graphene-Paraffin Material Coated Signal Lines with Tabs," Proceedings of the 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (2019, Taiyuan, China), Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/CSQRWC.2019.8799170
Meeting Name
2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference, CSQRWC 2019 (2019: Jul. 18-19, Taiyuan, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
DDR5; Far-End Crosstalk (FEXT); Graphene-Paraffin Material; High-Density PCBs; Mitigation; Tabs
International Standard Book Number (ISBN)
978-172811372-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019
Comments
This work is supported by Intel Corporation.