HO-SIE based Domain Decomposition Method for Solving Multiscale Em Scattering Problems
Abstract
In this paper, a novel non-overlapping and noncon-formal domain decomposition method (DDM) based on surface integral equation (SIE) is developed for the electromagnetic (EM) scattering analysis of multiscale PEC objects. In this work, by adopting an interior penalty term, a discontinuous Galerkin approach can be utilized to avoid the introduction of artificial touching faces between adjacent subdomains and avoid the introduction of stabilization term depending on the line integral over interactions of nonconformal meshes. To enhance the efficiency of modeling subdomains, higher order hierarchical vector (HOHV) basis functions defined on curved triangular patches are used in this SIE to reduce computational cost. Moreover, an additive non-overlapping DD preconditioner is also constructed for the fast iterative solution. Two numerical results are given to demonstrate the validity of this HO-SIE-DDM.
Recommended Citation
Q. Cai et al., "HO-SIE based Domain Decomposition Method for Solving Multiscale Em Scattering Problems," Proceedings of the 2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (2019, Taiyuan, China), Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/CSQRWC.2019.8799194
Meeting Name
2019 Cross Strait Quad-Regional Radio Science and Wireless Technology Conference, CSQRWC 2019 (2019: Jul. 18-19, Taiyuan, China)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Discontinuous Galerkin; Domain Decomposition Method (DDM); Higher Order Hierarchical Vector (HOHV) Basis Functions; Nonconformal; Surface Integral Equation (SIE).
International Standard Book Number (ISBN)
978-172811372-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019
Comments
This work is supported by National Science Foundation of China (No.61801406), and Longshan Talent Fund of Southwest University of Science and Technology (No.18lzx677).