Fast Transmitter and Receiver Eye Diagrams Acquisition in the MIPI D-PHY Interface
Abstract
The mobile industry processor interface (MIPI) standards defines industry specification for design of mobile devices such as smartphone, tables, laptop and hybrid devices. Such standard plays a critical role in the Internet of Things (IoT), 5G mobile devices, as well as autopilot automobiles. MIPI specification has comprehensive requirements on the data storage, data transfer, display, camera, memory, power, etc on the transmitter and receiver. In the testing phase, the transmitter and receiver may not be easily directly measured. Herein, a fast transmitter and receiver eye diagrams calculation methodology is necessary to predict the RX and TX performances of those devices. The calculated RX and TX eye diagrams are evaluated by using the D-PHY protocol to identify the quality of the signals. An in-house MIPI tool is built to directly display the calculated eye diagrams as well as the MIPI D-PHY report in the PC. The validations are performed by using both simulation and measurement examples.
Recommended Citation
B. Chen et al., "Fast Transmitter and Receiver Eye Diagrams Acquisition in the MIPI D-PHY Interface," Proceedings of the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2019, New Orleans, LA), pp. 570 - 574, Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/ISEMC.2019.8825304
Meeting Name
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
5G Mobile Devices; Autopilot Automobile; D-PHY; Eye Diagram; HS CLK; HS Data; IoT; LP Data; MIPI; Receiver; Transmitter
International Standard Book Number (ISBN)
978-153869199-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019
Comments
This material is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.