Low Leakage Electromagnetic Field Level and High Efficiency using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System
Abstract
In this paper, we first proposed a novel hybrid loop array (HLA) for low leakage electromagnetic field (EMF) level and high efficiency in a wireless high power transfer system. The proposed HLA effectively enhances the system efficiency and shields leakage EMF in a wireless power transfer (WPT) system using kHz range resonant frequency. The key originality of the proposed HLA is the combination of two types of loop coil; shielding loop coil (SLC) and amplifying loop coil (ALC). SLCs reduce leakage EMF, and ALCs significantly enhance the magnetic field from a Tx coil. The simulation and experiment results show that the proposed solution successfully overcomes the limitations of the existing solutions. Analytical modeling and design procedure are introduced and discussed. In addition, the experimental verification of the simulation result is included. We first designed and modeled an HLA considering the coupling effect of neighboring loop coils to evaluate its efficiency and leakage EMF. With the proposed HLA, we demonstrated a 9.36% improvement in the efficiency and 3 dBm reduction in the leakage EMF near the WPT system.
Recommended Citation
S. Lee et al., "Low Leakage Electromagnetic Field Level and High Efficiency using a Novel Hybrid Loop-Array Design for Wireless High Power Transfer System," IEEE Transactions on Industrial Electronics, vol. 66, no. 6, pp. 4356 - 4367, Institute of Electrical and Electronics Engineers (IEEE), Jun 2019.
The definitive version is available at https://doi.org/10.1109/TIE.2018.2851988
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electromagnetic compatibility (EMC); electromagnetic field (EMF); ferrite; magnetic field forming; wireless power transfer (WPT)
International Standard Serial Number (ISSN)
0278-0046
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jun 2019