High Efficiency Wireless Power Transfer System using a Two-Stack Hybrid Metamaterial Slab
Abstract
In this paper, we proposed a two-stack hybrid metamaterial slab to enhance the power transfer efficiency in wireless power transfer (WPT) system. A hybrid metamaterial is consist of zero magnetic permeability unit cells and negative magnetic permeability unit cells. Previous research shows that a hybrid metamaterial slab slightly enhances power transfer efficiency of WPT system. We first used a two-stack hybrid metamaterial slab and it shows considerably the enhanced power transfer efficiency compared to one hybrid metamaterial case. We verified the power transfer efficiency with S-parameter measurement. Thus, we finally achieved maximum 25.4% efficiency enhancement when the distance between Tx and Rx coils is 15 cm, and in overall distance variation cases, the proposed two-stack hybrid metamaterial slab make the power transfer efficiency increase.
Recommended Citation
S. Lee et al., "High Efficiency Wireless Power Transfer System using a Two-Stack Hybrid Metamaterial Slab," Proceedings of the 2019 IEEE Wireless Power Transfer Conference (2019, London, United Kingdom), pp. 616 - 619, Institute of Electrical and Electronics Engineers (IEEE), Jun 2019.
The definitive version is available at https://doi.org/10.1109/WPTC45513.2019.9055525
Meeting Name
2019 IEEE Wireless Power Transfer Conference, WPTC 2019 (2019: Jun. 18-21, London, United Kingdom)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Metamaterial; Power Transfer Efficiency; Wireless Power Transfer
International Standard Book Number (ISBN)
978-172810705-9
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
21 Jun 2019
Comments
This research was supported by a grant (19RTRP-B097064-05) from Railroad Technology Research Program funded by Ministry of Land, Infrastructure and Transport of Korean government and the MSIP (Ministry of Science, ICT and Future Planning, Korea, under the ITRC (Information Technology Research Center) support program (IITP-2018-2016-0-00291) supervised by the IITP (National IT Industry Promotion Agency). This research was supported by “Development of Interconnection System and Process for Flexible Three Dimensional Heterogeneous Devices†funded by MOTIE (Ministry of Trade, Industry and Energy) in Korea. This works was supported by the Core & Integration Technology grant funded by the Korea Evaluation Institute of Indus-trial Technology (KEIT) (No. 10062323).