Numerical Simulation on Thermal Response for Dynamic Non-Destructive Detection of Weak Bonds in Carbon Fiber Reinforced Polymer
Abstract
The aim of this work is to study the pulse thermal response on the nondestructive inspection of weak bond in carbon fiber reinforced polymer (CFRP) using finite element (FE) model. Simulations of thermal responses of weak bonds to external loads have been conducted using finite element models of the CFRP specimens with defects/weak bonds sandwiched in between CFRP layers. The resulting thermal evolution field is comprised of thermal properties variation between the defect and CFRP; and the important characteristic of the defects can be obtained from evolution of the field distribution. We study the depth and size of defect buried in various layers; and the result shows promising defect detection with resolution contrast up to ∼ 0.07K. Also, we estimate the thermal contrast when the thickness of defect is approximately to zero for predicting the zero-thickness weak bonds in the laminate layers.
Recommended Citation
Y. S. Hor et al., "Numerical Simulation on Thermal Response for Dynamic Non-Destructive Detection of Weak Bonds in Carbon Fiber Reinforced Polymer," Progress in Electromagnetics Research Symposium, pp. 1419 - 1422, Institute of Electrical and Electronics Engineers (IEEE), Aug 2018.
The definitive version is available at https://doi.org/10.23919/PIERS.2018.8597641
Meeting Name
2018 Progress In Electromagnetics Research Symposium, PIERS-Toyama 2018 (2018: Aug. 1-4, Toyama, Japan)
Department(s)
Physics
Keywords and Phrases
Defects; Fiber reinforced plastics; Finite element method; Nondestructive examination; Reinforced plastics; Reinforcement, Carbon fiber reinforced polymer; Defect detection; Field distribution; Non destructive inspection; Nondestructive detection; Thermal contrasts; Thermal evolution; Thermal response, Carbon fiber reinforced plastics
International Standard Book Number (ISBN)
978-4885523151
International Standard Serial Number (ISSN)
1559-9450
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 The Institute of Electronics, Information and Communication Engineers (IEICE), All rights reserved.
Publication Date
01 Aug 2018