Abstract
A prestressed rectangular film clamped at both ends delaminates from a rigid punch. based on a thermodynamic energy balance, the delamination mechanics is derived to relate the simultaneous external tensile force applied to the punch, punch displacement, and contact area. Effects of the coupled tensile residual membrane stress and adhesion energy at the punch-film interface are investigated. a "pinch off" (stable shrinking of the contact area to a line) is predicted, contrasting the nonzero "pull-off" radius in a clamped circular film. the model is useful in understanding the behavior of various adhesion-delamination phenomena, especially in one dimensional capacitive microelectromechanical systems radio frequency switches, microstructure network, and nanostructures. © 2007 American Institute of Physics.
Recommended Citation
M. F. Wong et al., "Adhesion-Delamination Mechanics of a Prestressed Rectangular Film Adhered Onto a Rigid Substrate," Journal of Applied Physics, vol. 101, no. 2, article no. 024903, American Institute of Physics, Mar 2007.
The definitive version is available at https://doi.org/10.1063/1.2422775
Department(s)
Mechanical and Aerospace Engineering
Publication Status
Available Access
International Standard Serial Number (ISSN)
0021-8979
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2024 American Institute of Physics, All rights reserved.
Publication Date
13 Mar 2007
Comments
National Science Foundation, Grant 0757140