Adhesion-Delamination Mechanics of a Prestressed Circular Film Adhered Onto a Rigid Substrate

Abstract

A thin circular film clamped at the periphery is adhered to the planar surface of a rigid cylindrical punch. an external tensile load is applied to the punch, causing the film to delaminate from the substrate and the circular contact edge to contract. the film spontaneously separates from the punch, or pulls off, when the contact radius reduces to a range between 0.1758 and 0.3651 of the film radius, depending on the magnitude of the residual membrane stress. the mechanical delamination process is derived by a thermodynamic energy balance based on a coupled interfacial adhesion and residual membrane stress. the theoretical model has significant implications in nanoforce measurement, microelectromechanical systems (MEMS) comprising active moveable films, and biological cell adhesion.

Department(s)

Mechanical and Aerospace Engineering

Comments

National Science Foundation, Grant 0527912

Keywords and Phrases

Adhesion; Delamination; Pull in; Pull off; Residual stress; Thin film

International Standard Serial Number (ISSN)

1545-5823; 0021-8464

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Taylor and Francis Group; Taylor and Francis, All rights reserved.

Publication Date

01 Jan 2007

Link to Full Text

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