Kinetic Particle Simulations of Dust Charging in Low Temperature Collisionless Plasmas
Abstract
This paper presents a fully-kinetic numerical investigation of charging of dust particulates in low temperature collisionless plasmas. The recently developed Parallel Immersed-Finite-Element Particle-in-Cell (PIFE-PIC) code is utilized to self-consistently resolve the plasma environment and charging of immersed materials. This model explicitly includes the materials property (dielectric constant) of dust grains. Multiple dust grain configurations were considered and compared to find how single and multiple dust grains are charged in a stationary plasma environment.
Recommended Citation
D. Lund and D. F. Han, "Kinetic Particle Simulations of Dust Charging in Low Temperature Collisionless Plasmas," Proceedings of the AIAA Science and Technology Forum and Exposition (2022, San Diego, CA), article no. AIAA 2022-1106, American Institute of Aeronautics and Astronautics (AIAA), Jan 2022.
The definitive version is available at https://doi.org/10.2514/6.2022-1106
Meeting Name
AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2022 (2022: Jan. 3-7, San Diego, CA and Online)
Department(s)
Mechanical and Aerospace Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
International Standard Book Number (ISBN)
978-162410631-6
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2022 The Authors, All rights reserved.
Publication Date
07 Jan 2022
Comments
Session: Plasma Numerical Modeling I
This work was partially supported by a NASA Space Technology Graduate Research Opportunity, NASA-Missouri Space Grant Consortium through NASA-EPSCoR-Missouri and graduate scholarships, as well as NSF through grants DMS-2111039 and CBET-2132655. The simulations presented here were performed with computing resources provided by the Center for High Performance Computing Research at Missouri University of Science and Technology through an NSF grant OAC-1919789.