Thermal Contact Conductance of Ceramic Substrate Junctions

Author

John W. Sheffield, Missouri University of Science and TechnologyFollow
Kee-Chiang Chung
H. K. Benson

Recommended Citation

J. W. Sheffield et al., "Thermal Contact Conductance of Ceramic Substrate Junctions," Journal of Heat Transfer, American Society of Mechanical Engineers (ASME), May 1995.

Department(s)

Mechanical and Aerospace Engineering

International Standard Serial Number (ISSN)

0022-1481

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1995 American Society of Mechanical Engineers (ASME), All rights reserved.

Publication Date

01 May 1995