Abstract
Copper nucleation and growth on titanium substrates from concentrated acidic copper sulfate solutions was studied at 45 and 65 °C and high cathodic potentials. Electrochemical experiments allied to SEM examination were performed to characterize the mechanism of nucleation and its evolution with time. Particular emphasis was given to the influence of potential and agitation on the initial stages of nucleation and growth. Results indicated that most of copper nucleation on titanium from a 83 g dm-3 Cu2+ solution, at 65 °C, is achieved in a matter of milliseconds. As expected, the initial stages of the copper nucleation and growth is strongly dependent of potential and temperature, and the influence of agitation is only evident at very high potentials. The calculated diffusion coefficients for Cu2+ at 45 and 65 °C, under the experimental conditions, were found to be 9.16x10-6 and 1.62x10-5 cm2 s-1, respectively.
Recommended Citation
A. J. Dutra and T. J. O'Keefe, "Copper Nucleation on Titanium for Thin Film Applications," Journal of Applied Electrochemistry, vol. 29, no. 10, pp. 1217 - 1227, Springer, Jan 1999.
The definitive version is available at https://doi.org/10.1023/A:1003537318303
Department(s)
Materials Science and Engineering
International Standard Serial Number (ISSN)
0021-891X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Springer, All rights reserved.
Publication Date
01 Jan 1999
Comments
University of Missouri, Grant None