The Influence of Chloride and Glue on Copper Electrocrystallization on Titanium for Thin Film Applications
Abstract
Electrocrystallization studies were conducted in a concentrated acid-copper electrolyte to determine the influence of chloride ions and glue on copper nucleation and on the structure of thin copper layers. Electrochemical experiments allied to SEM and XRD examination were performed to characterize the mechanism of nucleation in the presence of additives at 65°C. Results indicated that most of the copper nucleation from a 83 g dm-3 Cu2+ solution, with 140 g dm-3 of H2SO4 is achieved in a matter of milliseconds. Although the presence of chloride and glue, at the concentration levels tested, does not seem to substantially modify the nucleation mechanism, the morphology, nuclei density and the copper film structure and orientation are changed by the presence of additives and by electrolyte stirring.
Recommended Citation
A. J. Dutra and T. J. O'Keefe, "The Influence of Chloride and Glue on Copper Electrocrystallization on Titanium for Thin Film Applications," 4th International Conference COPPER 99-COBRE 99, pp. 495 - 509, The Minerals, Metals and Materials Society, Dec 1999.
Department(s)
Materials Science and Engineering
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 The Minerals, Metals and Materials Society, All rights reserved.
Publication Date
01 Dec 1999
