Abstract

The effects of glue and calcium lignin sulfonate additives, and chloride and antimony impurities on the lead electrowinning process, using a fluoborate electrolyte, were studied. Short-term deposition tests, voltammetry, electrochemical impedance spectroscopy (EIS) and SEM techniques were used for the evaluation. The interactions among additives and impurities were also evaluated. The presence of antimony or chloride ion in the range of 50 to 200 mg/L was shown to cause a more dendritic and powdery lead deposit. Additions of glue and calcium lignin sulfonate at selected concentrations helped to level the deposit and counteracted the detrimental effects of chloride and antimony. The voltammetry and EIS characteristics obtained with additions of glue and calcium lignin sulfonate to the electrolyte indicated the roles of these components in modifying the lead deposition mechanisms and the deposit morphology. © 2001 Elsevier Science B.V.

Department(s)

Materials Science and Engineering

Keywords and Phrases

Additives; EIS; Electrowinning; Lead

International Standard Serial Number (ISSN)

0304-386X

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Elsevier, All rights reserved.

Publication Date

01 Aug 2001

Included in

Metallurgy Commons

Share

 
COinS