Abstract
A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation of copper. The oxide films were made galvanostatically at 25°C in 1 M sulphuric acid on pure titanium metal. Potentiodynamic, potential step and current step experiments were performed in an additive-free copper sulphate-sulphuric acid electrolyte at 25°C. It was found that the oxide film played an important role during nucleation. By increasing the thickness of the anodic film, it was possible to decrease the diameter and to increase the surface density of copper nuclei. The kinetics of nucleation and growth of the copper deposits were analyzed. The deposits were examined by SEM. © 1989.
Recommended Citation
J. L. Delplancke et al., "Nucleation Of Electrodeposited Copper On Anodized Titanium," Hydrometallurgy, vol. 23, no. 1, pp. 47 - 66, Elsevier, Jan 1989.
The definitive version is available at https://doi.org/10.1016/0304-386X(89)90017-0
Department(s)
Materials Science and Engineering
International Standard Serial Number (ISSN)
0304-386X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Elsevier, All rights reserved.
Publication Date
01 Jan 1989
Comments
National Science Foundation, Grant CPE 8410867