Abstract
An alternate approach for fabricating PZT/polymer composites with 2-2 connectivity with fine scales is described. Thin (less than or equal to 20 micrometers) sintered PZT plates and sheets of a thermoplastic polymer film (less than or equal to 10 micrometers) were bonded together via thermal processing. Stack sintering of tape cast PZT generated the necessary PZT plates, while tape cast polymers were used to control the thermoplastic thickness. Composite blocks were cut to required dimensions for linear arrays, electroded, and poled. Electromechanical properties were measured to evaluate the composites. The significance of this fabrication technique is that it is able to generate 2-2 structures at a scale level unachievable by conventional dice-and-fill fabrication methods.
Recommended Citation
W. Huebner et al., "Fabrication of 2-2 Connectivity PZT/Thermoplastic Composites for High Frequency Linear Arrays," Proceedings of the 9th IEEE International Symposium on Applications of Ferroelectrics, 1994, Institute of Electrical and Electronics Engineers (IEEE), Jan 1994.
The definitive version is available at https://doi.org/10.1109/ISAF.1994.522339
Meeting Name
9th IEEE International Symposium on Applications of Ferroelectrics, 1994
Department(s)
Materials Science and Engineering
Keywords and Phrases
10 Mum; 2-2 Connectivity PZT/Thermoplastic Composites; 20 Mum; PZT; PZT/Polymer Composites; PbZrO3TiO3; Composite Blocks; Composite Materials; Dielectric Polarisation; Electroded Arrays; Electromechanical Properties; Fabrication; Fine Scale; Heat Treatment; High Frequency Linear Arrays; Lead Compounds; Linear Arrays; Piezoceramics; Piezoelectric Transducers; Poled Arrays; Polymer Films; Sintered PZT Plates; Sintering; Stack Sintering; Tape Cast PZT; Tape Cast Polymers; Thermal Processing; Thermoplastic Polymer Film; Ultrasonic Transducer Arrays
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 1994