Masters Theses
Keywords and Phrases
3D ICs; DC-DC converters; Resonant clocking; TSV inductors
Abstract
"This thesis focuses on the technique for the improvement of quality factor and inductance of the TSV inductors and then on the utilization of TSV inductors in various on-chip applications such as DC-DC converter and resonant clocking. Through-silicon-vias (TSVs) are the enabling technique for three-dimensional integrated circuits (3D ICs). However, their large area significantly reduces the benefits that can be obtained by 3D ICs. On the other hand, a major limiting factor for the implementation of many on-chip circuits such as DC-DC converters and resonant clocking is the large area overhead induced by spiral inductors. Several works have been proposed in the literature to make inductors out of idle TSVs. In this thesis, the technique to improve the quality factor and inductance is proposed and then discusses about two applications utilizing TSV inductors i.e., inductive DC-DC converters and LC resonant clocking. The TSV inductor performs inferior to spiral inductors due to its increases losses. Hence to improve the performance of the TSV inductor, the losses should be reduced. Inductive DC-DC converters become prominent for on-chip voltage conversion because of their high efficiency compared with other types of converters (e.g. linear and capacitive converters). On the other hand, to reduce on-chip power, LC resonant clocking has become an attractive option due to its same amplitude and phases compared to other resonant clocking methods such as standing wave and rotary wave. A major challenge for both applications is associated with the required inductor area. In this thesis, the effectiveness of such TSV inductors in addressing both challenges are demonstrated"--Abstract, page iv.
Advisor(s)
Shi, Yiyu
Committee Member(s)
Choi, Minsu
Fan, Jun, 1971-
Department(s)
Electrical and Computer Engineering
Degree Name
M.S. in Computer Engineering
Sponsor(s)
National Science Foundation (U. S. )
Publisher
Missouri University of Science and Technology
Publication Date
Fall 2014
Pagination
xii, 74 pages
Note about bibliography
Includes bibliographical references (pages 71-73).
Rights
© 2014 Umamaheswara Rao Tida, All rights reserved.
Document Type
Thesis - Open Access
File Type
text
Language
English
Subject Headings
Three-dimensional integrated circuits -- Design and construction
DC-to-DC converters
Integrated circuits -- Very large scale integration -- Computer-aided design
Thesis Number
T 10601
Electronic OCLC #
902737222
Recommended Citation
Tida, Umamaheswara Rao, ""Green" on-chip inductors in three-dimensional integrated circuits" (2014). Masters Theses. 7347.
https://scholarsmine.mst.edu/masters_theses/7347