Masters Theses

Keywords and Phrases

3D ICs; DC-DC converters; Resonant clocking; TSV inductors

Abstract

"This thesis focuses on the technique for the improvement of quality factor and inductance of the TSV inductors and then on the utilization of TSV inductors in various on-chip applications such as DC-DC converter and resonant clocking. Through-silicon-vias (TSVs) are the enabling technique for three-dimensional integrated circuits (3D ICs). However, their large area significantly reduces the benefits that can be obtained by 3D ICs. On the other hand, a major limiting factor for the implementation of many on-chip circuits such as DC-DC converters and resonant clocking is the large area overhead induced by spiral inductors. Several works have been proposed in the literature to make inductors out of idle TSVs. In this thesis, the technique to improve the quality factor and inductance is proposed and then discusses about two applications utilizing TSV inductors i.e., inductive DC-DC converters and LC resonant clocking. The TSV inductor performs inferior to spiral inductors due to its increases losses. Hence to improve the performance of the TSV inductor, the losses should be reduced. Inductive DC-DC converters become prominent for on-chip voltage conversion because of their high efficiency compared with other types of converters (e.g. linear and capacitive converters). On the other hand, to reduce on-chip power, LC resonant clocking has become an attractive option due to its same amplitude and phases compared to other resonant clocking methods such as standing wave and rotary wave. A major challenge for both applications is associated with the required inductor area. In this thesis, the effectiveness of such TSV inductors in addressing both challenges are demonstrated"--Abstract, page iv.

Advisor(s)

Shi, Yiyu

Committee Member(s)

Choi, Minsu
Fan, Jun, 1971-

Department(s)

Electrical and Computer Engineering

Degree Name

M.S. in Computer Engineering

Sponsor(s)

National Science Foundation (U. S. )

Publisher

Missouri University of Science and Technology

Publication Date

Fall 2014

Pagination

xii, 74 pages

Note about bibliography

Includes bibliographical references (pages 71-73).

Rights

© 2014 Umamaheswara Rao Tida, All rights reserved.

Document Type

Thesis - Open Access

File Type

text

Language

English

Subject Headings

Three-dimensional integrated circuits -- Design and constructionDC-to-DC convertersIntegrated circuits -- Very large scale integration -- Computer-aided design

Thesis Number

T 10601

Electronic OCLC #

902737222

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