Masters Theses
Keywords and Phrases
Reactive ion etching
Abstract
"In this study, dry film photoresist was patterned using UV lithography and the sidewall profile was optimized to achieve vertical sidewalls. Sidewall verticality of dry film is very important for better pattern transfer"--Abstract, page iv.
Advisor(s)
OKeefe, Matt
Committee Member(s)
Kim, Chang-Soo
Miller, F. Scott, 1956-
Department(s)
Materials Science and Engineering
Degree Name
M.S. in Materials Science and Engineering
Sponsor(s)
National Science Foundation (U.S.)
Publisher
University of Missouri--Rolla
Publication Date
Summer 2007
Journal article titles appearing in thesis/dissertation
- Process development and application of dry film photoresist in MEMS
- Process development for reactive-ion etching of dry film photoresist
Pagination
x, 66 pages
Rights
© 2007 Phaninder Reddy Kanikella, All rights reserved.
Document Type
Thesis - Open Access
File Type
text
Language
English
Subject Headings
Microelectromechanical systems
Semiconductors -- Etching
Thesis Number
T 9243
Print OCLC #
233638949
Electronic OCLC #
182857762
Link to Catalog Record
Recommended Citation
Kanikella, Phaninder R., "Process development and applications of a dry film photoresist" (2007). Masters Theses. 6821.
https://scholarsmine.mst.edu/masters_theses/6821
