The influence of printed circuit board design on TEM cell measurements

Author

Vijay Kasturi

Keywords and Phrases

TEM cell method

Abstract

"The IEC 61967-2 integrated circuit radiated emissions test standard describes the use of the TEM cell to measure near-field emissions from an IC. This test requires a printed circuit board (PCB) to mount to IC. The IEC guidelines allow for flexibility in the design of this test PCB which may cause variations in the measured emissions. This thesis studies the impact of typical variations in the PCB design on the measured emissions"--Abstract, page iii.

Advisor(s)

Beetner, Daryl G.

Committee Member(s)

Van Doren, Thomas, 1940-
Hubing, Todd H.

Department(s)

Electrical and Computer Engineering

Degree Name

M.S. in Electrical Engineering

Publisher

University of Missouri--Rolla

Publication Date

Fall 2007

Pagination

xii, 107 pages

Note about bibliography

Includes bibliographical references (page 39).

Rights

© 2007 Vijay Kasturi, All rights reserved.

Document Type

Thesis - Open Access

File Type

text

Language

English

Subject Headings

Electromagnetic compatibilityElectromagnetic measurementsIntegrated circuits -- DesignNear-fields -- Measurement

Thesis Number

T 9298

Print OCLC #

234197153

Electronic OCLC #

213817632

Recommended Citation

Kasturi, Vijay, "The influence of printed circuit board design on TEM cell measurements" (2007). Masters Theses. 4595.
https://scholarsmine.mst.edu/masters_theses/4595