Abstract
Transmission Lines Referenced to Meshed Return Planes Are Widely Used Because of the Physical Flexibility Imparted by the Meshed Plane. Poor Accounting for the Meshed Ground, However, Can Lead to Severe Signal Integrity and Radio Frequency Interference Issues. Full-Wave Simulation Can Characterize the Electrical Performance at an Early Design Stage, But It is Both Time and Computational Resource Consuming. to Make the Simulation More Efficient, a Method is Proposed in This Study to Model Transmission Lines with a Meshed Reference Ground using 2D Analysis. the 2D Analysis is Performed at Several Locations Along the Length of the Trace above the Meshed Return to Determine Per-Unit-Length RLGC Parameters and Partial Self - and Mutual-Inductances of the Trace and Meshed Return. the Partial Self-Inductance of the Return is Then Corrected to Account for the Current Direction Along the Mesh. Cascading the Corrected S-Parameters for Each Segment is Then Used to Estimate the overall Characteristics of the Transmission Line. Results Found using This Approach Closely Match Those Found with 3D Full-Wave Simulation.
Recommended Citation
Z. Sun et al., "Modeling of a Microstrip Line Referenced to a Meshed Return Plane," 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp. 291 - 295, Institute of Electrical and Electronics Engineers, Jan 2023.
The definitive version is available at https://doi.org/10.1109/EMCSIPI50001.2023.10241651
Department(s)
Engineering Management and Systems Engineering
Second Department
Electrical and Computer Engineering
Keywords and Phrases
Meshed return plane; S-parameter; transmission line
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2023
Included in
Electrical and Computer Engineering Commons, Operations Research, Systems Engineering and Industrial Engineering Commons
Comments
National Science Foundation, Grant IIP-1916535