Abstract
Frequency selective surfaces (FSSs) are arrays of conductive elements or apertures that exhibit frequency-dependent reflection and transmission properties. Their electromagnetic response is influenced by geometry and environmental conditions, making them attractive for wireless strain-sensing applications. However, temperature variations can produce frequency shifts similar to those caused by strain, reducing measurement accuracy. This work investigates the effects of intrinsic temperature compensation on two common FSS unit cell geometries—loop and patch—through comprehensive simulation analysis. The results show that loop-based cells offer superior thermal stability, while patch-based cells provide greater strain sensitivity, illustrating the trade-off between thermal robustness and mechanical responsiveness. A patch-type FSS strain sensor was designed, fabricated, and characterized under varying temperature and strain. The sensor achieves a strain sensitivity of ~150 MHz per 1 %εl, while temperature-induced drift is limited to ~12 MHz over a 200 °C range, confirming the effectiveness of the intrinsic compensation strategy. The results provide valuable insights for optimizing FSS-based sensor design in structural health monitoring applications and balancing thermal stability with mechanical sensitivity to ensure reliable performance in thermally dynamic environments.
Recommended Citation
S. M. Ramesh and K. M. Donnell, "Temperature Compensation in Loop and Patch FSS Strain Sensors: Analysis and Experimental Validation," IEEE Open Journal of Instrumentation and Measurement, Institute of Electrical and Electronics Engineers, Jan 2026.
The definitive version is available at https://doi.org/10.1109/OJIM.2025.3650259
Department(s)
Electrical and Computer Engineering
Publication Status
Open Acess
Keywords and Phrases
Coefficient of thermal expansion; frequency selective surface; strain sensing; temperature coefficient of dielectric constant; temperature compensation; wireless sensing
International Standard Serial Number (ISSN)
2768-7236
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2026 The Authors, All rights reserved.
Creative Commons Licensing
This work is licensed under a Creative Commons Attribution 4.0 License.
Publication Date
01 Jan 2026
