Abstract
This paper introduces vertical interconnect technology in silicon, package, and printed circuit board (PCB) levels with a coaxial structure, respectively. The coaxial structure has been known to be advantageous in terms of signal integrity (SI) compared to the non-coaxial structure. The coaxial structure is easy to control the characteristic impedance Z0 and robust to crosstalk. The silicon-level interconnect includes the wire bonding (WB) and through-silicon via (TSV) technology, the package-level interconnect includes an elastomer package test socket. The PCB-level interconnect includes the vias, and vertical conductive structure (VeCS). For each level, the non-coaxial and coaxial interconnects are compared with the measurement results in the frequency domain. In conclusion, this paper successfully shows the improvement of the coaxial structure at silicon, package, and PCB levels.
Recommended Citation
J. Park et al., "Vertical Interconnect Technology in Silicon, Package, and Printed Circuit Board (PCB) with Coaxial Structure," IEEE International Symposium on Electromagnetic Compatibility, pp. 39 - 44, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/EMCSIPI49824.2024.10705593
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3D integrated circuit; coaxial structure; package; PCB; signal integrity; TSV; vertical interconnect
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2024
Comments
National Science Foundation, Grant IIP-1916535