Abstract
There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. To reduce the large area overhead induced by conventional spiral inductors, existing literature has used through-silicon-vias (TSVs) inductors in basic DC-DC converters without feedback control. In this paper, we further study the possible application of TSV inductors in DC-DC converters with Pulse Width Modulation (PWM)-controlled feedback. The DC-DC converter with TSV inductor is at par in terms of performance with other conventional designs in the literature. Experimental results show that by replacing conventional spiral inductors with TSV inductors, up to 4.3x inductor area reduction can be achieved with almost the same efficiency and output voltage for 45 nm buck converters.
Recommended Citation
P. N. Kankonkar et al., "PWM-controlled DC-DC Converter Designs in 3D ICs using through-silicon-via Inductors," China Semiconductor Technology International Conference 2016, CSTIC 2016, article no. 7463922, Institute of Electrical and Electronics Engineers, May 2016.
The definitive version is available at https://doi.org/10.1109/CSTIC.2016.7463922
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-146738804-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
02 May 2016
