Abstract
Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described by modal decomposition. It is shown that the models can be applied to efficiently simulate a wide range of structures. Different scenarios are analyzed including thru-hole and buried vias, power vias, and coupled traces routed into different layers. by virtue of the modal decomposition, the proposed method is general enough to handle structures with mixed reference planes. for the first time, these models have been validated against full-wave methods and measurements up to 40 GHz. an improvement on the computation speed of at least two orders of magnitude has been observed with respect to full-wave simulations. © 2009 IEEE.
Recommended Citation
R. Rimolo-Donadio and X. Gu and Y. H. Kwark and M. B. Ritter and B. Archambeault and F. De Paulis and Y. Zhang and J. Fan and H. D. Brüns and C. Schuster, "Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz," IEEE Transactions on Microwave Theory and Techniques, vol. 57, no. 8, pp. 2072 - 2083, article no. 5173506, Institute of Electrical and Electronics Engineers, Jan 2009.
The definitive version is available at https://doi.org/10.1109/TMTT.2009.2025470
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Modal decomposition; Package; Power distribution network (PDN); Printed circuit board (PCB); Via models
International Standard Serial Number (ISSN)
0018-9480
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2009
Comments
Defense Advanced Research Projects Agency, Grant HR0011-06-C-0074