Abstract
Signal vias are often used to move a signal from one PCB layer to another. as a result, these vias can penetrate power/ground plane pair and cause noise coupling (crosstalk) between signal and power/ground nets. This paper studies the noise coupling mechanism using a segmentation approach combined with a via capacitance model and a plane-pair cavity model. Noise coupling from signal to power/ground, and vice versa, is demonstrated in the modeling results.
Recommended Citation
J. Fan et al., "Noise Coupling between Signal and Power/ground Nets Due to Signal Vias Transitioning through Power/ground Plane Pair," IEEE International Symposium on Electromagnetic Compatibility, article no. 4652117, Institute of Electrical and Electronics Engineers, Jan 2008.
The definitive version is available at https://doi.org/10.1109/ISEMC.2008.4652117
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
cavity model; Noise coupling; signal and power/ground nets; signal via transition; via capacitance
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2008
