Abstract
Via-plate interaction can be modeled as lumped circuits for vias and a two-dimensional field problem for the plate domain. the accuracy of the improved intrinsic via model and the conventional physics-Based via model is investigated by comparing them with either analytical formula or numerical simulations for a via in a circular plate pair with various edge boundary conditions. It is found that the intrinsic via model matches very well with both the analytical formula and numerical solutions in all the examples studied. However, the physics-Based via model is only an acceptable approximation at low frequencies and its accuracy is not dependent on the plate size but on the via itself. It is observed that the physics-Based via model is more accurate for a plate par with smaller plate separations.
Recommended Citation
Y. Zhang and J. Fan, "Recent Development of Via Models: Hybrid Circuit and Field Analysis," 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, article no. 5683001, Institute of Electrical and Electronics Engineers, Dec 2010.
The definitive version is available at https://doi.org/10.1109/EDAPS.2010.5683001
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Hybrid circuit and field analysis; Intrinsic via circuit model; Physics-based via circuit model; Via-plate interactions
International Standard Book Number (ISBN)
978-142449068-4
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2010
