"Investigation of Crosstalk among Vias" by Songping Wu and Jun Fan
 

Abstract

Crosstalk among vias is a critical problem in highspeed digital circuits, deteriorating signal quality and increasing jitter, especially when circuit density is high. Underlying mechanism of crosstalk among vias is investigated in this paper. using a physics-Based equivalent circuit model, crosstalk as a function of various geometrical parameters, including parallel plane pair thickness, layer count in printed circuit board (PCB) stack up, ground via patterns, and parallel plane pair dimensions, has been investigated. a multi-step crosstalk evaluation procedure is proposed based on the study for PCB layout-design verifications. © 2009 IEEE.

Department(s)

Electrical and Computer Engineering

International Standard Book Number (ISBN)

978-142444267-6

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.

Publication Date

01 Dec 2009

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