Abstract
Thin oxide films were grown at temperatures from 373 to 1073 K in plasma and in air on commercially pure titanium substrates. It was determined that the color, thickness, composition, phase, and polarization behavior in a copper electrolyte varied with operating conditions: temperature, oxygen partial pressure, and plasma composition. High-temperature and high oxygen partial pressure plasma produced a thick oxide film. The surface film structure transformed from TiO2 (anatase) to TiO2 (rutile) at a temperature of 600 °C. A lower oxide of the form TinO2n-1, such as Ti2O3 (which may be porous) or possibly Ti3O5, was formed on a thermally treated sample (400 °C, 80 mtorr O2, 3 hours). This sample exhibited the lowest potential for copper nucleation and gave a very uniform, smooth, and hole-free copper foil.
Recommended Citation
K. S. Teng et al., "Electrochemical Characterization of Copper Deposited on Plasma and Thermally Modified Titanium Surfaces," Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science, vol. 29, no. 4, pp. 749 - 754, Springer, Jan 1998.
The definitive version is available at https://doi.org/10.1007/s11663-998-0133-8
Department(s)
Electrical and Computer Engineering
Second Department
Materials Science and Engineering
International Standard Serial Number (ISSN)
1073-5615
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Springer, All rights reserved.
Publication Date
01 Jan 1998
Comments
U.S. Department of Energy, Grant 8818746