Abstract
An eye diagram, a critical metric in signal integrity analysis for high-speed interconnects such as packages, interposer, and printed circuit boards (PCBs), is generated by superposition of the received waveform. Obtaining an eye diagram is time-consuming, thus signal integrity analysis is inefficient. This article reviews that have been proposed to overcome this limitation. The statistical eye diagram provides a probability distribution depending on a sampling time and voltage, therefore it can be expanded to other metrics, such as the bit-error rate and shmoo plot. This article introduces previous research on statistical eye diagrams applied to complementary metal-oxide-semiconductors (CMOSs), noise, and high-speed systems. The methods applied to CMOSs include asymmetry between the P/NMOS transistors and the nonlinearity of the CMOS. The methods applied to noise include signal and power noise. The methods applied to high-speed systems include equalizers, signaling, encoding, linear feedback shift register, and error correction code.
Recommended Citation
J. Park and D. Kim, "Statistical Eye Diagrams For High-Speed Interconnects Of Packages: A Review," IEEE Access, vol. 12, pp. 22880 - 22891, Institute of Electrical and Electronics Engineers, Jan 2024.
The definitive version is available at https://doi.org/10.1109/ACCESS.2024.3359037
Department(s)
Electrical and Computer Engineering
Publication Status
Open Access
Keywords and Phrases
Complementary metal-oxide-semiconductor (CMOS); crosstalk; double edge response (DER); encoding; equalizer; error correction code (ECC); eye diagram; multiple edge response (MER); package; pulse amplitude modulation (PAM); signal integrity (SI); single bit response (SBR); statistical eye diagram
International Standard Serial Number (ISSN)
2169-3536
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2024 The Authors, All rights reserved.
Creative Commons Licensing
This work is licensed under a Creative Commons Attribution 4.0 License.
Publication Date
01 Jan 2024
Comments
National Science Foundation, Grant IIP-1916535