Abstract
In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example. © 2009 IEEE.
Recommended Citation
J. Xie et al., "Electrical-thermal Co-analysis For Power Delivery Networks In 3D System Integration," 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, article no. 5306525, Institute of Electrical and Electronics Engineers, Dec 2009.
The definitive version is available at https://doi.org/10.1109/3DIC.2009.5306525
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3D integration; Electrical-thermal co-anlysis; IR drop; Joule heating; Power delivery network (PDN); Temperature effect; Through-silicon via (TSV)
International Standard Book Number (ISBN)
978-142444512-7
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2009
