Abstract
In this paper, parameterized electrical-thermal co-analysis for power delivery networks (PDN) in 3D system integration is carried out. A 3D integrated system including glass-ceramic substrate, single and stacked dies, power delivery network, through-silicon vias (TSVs), controlled collapse chip connections (C4s), underfill material, and thermal interface material (TIM) is analyzed with several variable parameters. The analysis results show that temperature effects on DC IR drop can not be neglected. The TIM thermal conductivity, C4 density, stacking order of stacked dies, and voltage source location affect the final IR drop and hot spot temperature in the system. ©2009 IEEE.
Recommended Citation
J. Xie et al., "Effect Of System Components On Electrical And Thermal Characteristics For Power Delivery Networks In 3D System Integration," 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp. 113 - 116, article no. 5338465, Institute of Electrical and Electronics Engineers, Dec 2009.
The definitive version is available at https://doi.org/10.1109/EPEPS.2009.5338465
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-142444447-2
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Dec 2009
