Abstract
In this paper, it is studied how the rate of coupling (weak vs. strong) in edge-coupled differential transmission lines on a printed circuit board (PCB) affects frequency behavior of mixed-mode S-parameters. This is important for signal integrity (SI), and also may be useful from electromagnetic compatibility (EMC) point of view, since the enhancement of mode conversion (from common-mode to differential mode, and vice versa) may result in common-mode noise in high-speed digital electronics. Slightly imbalanced in length microstrip and strip line differential pairs are considered. The study is done using full-wave numerical electromagnetic simulations. Various technological features are modeled in this work: rectangular vs. trapezoid shape of a signal trace cross-section; copper foil roughness; solder mask over microstrip lines; and presence of an epoxy-resin 'pocket' (EP) between the strip line traces (dielectric properties of the EP are different from the homogenized parameters of the ambient dielectric where these traces are embedded).
Recommended Citation
M. Koledintseva and T. Vincent, "Comparison Of Mixed-mode S-parameters In Weak And Strong Coupled Differential Pairs," IEEE International Symposium on Electromagnetic Compatibility, pp. 610 - 615, article no. 7571718, Institute of Electrical and Electronics Engineers, Sep 2016.
The definitive version is available at https://doi.org/10.1109/ISEMC.2016.7571718
Department(s)
Electrical and Computer Engineering
International Standard Book Number (ISBN)
978-150901441-5
International Standard Serial Number (ISSN)
2158-1118; 1077-4076
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
19 Sep 2016
