Abstract
The level of electromagnetic coupling to electronic devices can vary widely from one device to another. When considering the induced voltage from an incoming plane wave on printed circuit boards (PCBs) and their attached cable harnesses, there is significant variety in the configuration of the devices that could be seen. This encourages the use of segmentation, so that the components of these devices (PCBs, connectors, and harnesses) can be modeled separately to alleviate simulation burden. This allows for a more flexible model and a 'toolbox' to construct devices with. The goal of this work is to use segmentation to model the external electromagnetic radiation from these devices. The radiation pattern and reciprocity theory can later be used to calculate the voltage coupled from an incident plane wave. Most realistic devices exhibit strong common mode (or antenna mode) coupling that cannot be ignored during segmentation. When segmenting such structures, a multi-modal approach is needed to incorporate coupling from both the common (CM) and differential (DM) modes and to allow these currents to flow properly between the blocks. This work introduces the concept by segmenting a simple dipole, which requires the common mode only, and then applies the complete methodology to a more complicated structure that requires the incorporation of both modes.
Recommended Citation
J. Hunter et al., "A Segmentation Strategy for Structures with Common Mode Coupling," 2022 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2022, pp. 415 - 420, Institute of Electrical and Electronics Engineers, Jan 2022.
The definitive version is available at https://doi.org/10.1109/EMCSI39492.2022.9889666
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
common mode; differential mode; electromagnetic coupling; harness segmentation
International Standard Book Number (ISBN)
978-166540929-2
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2023 Institute of Electrical and Electronics Engineers, All rights reserved.
Publication Date
01 Jan 2022
Comments
National Science Foundation, Grant IIP-1916535