Resistance Modeling for Striplines with Different Surface Roughness on the Planes

Author

Shaohui Yong
Victor Khilkevich, Missouri University of Science and TechnologyFollow
Yuanzhuo Liu
Jiayi He, Missouri University of Science and Technology
Han Gao
Scott Hinaga
Darja Padilla
Douglas Yanagawa
Jun Fan, Missouri University of Science and TechnologyFollow
James L. Drewniak, Missouri University of Science and TechnologyFollow

Abstract

To model additional conductor loss due to foil surface roughness various empirical or physical models have been brought up to provide surface roughness correction factors for the per-unit-length (PUL) resistance assuming certain roughness of foil conductors. However for striplines on typical printed circuit board, different sides of the traces and references planes may have different surface roughness levels due to the fabrication process. Traditionally engineers may calculate surface roughness correction factors using averaged roughness level of the upper and lower sides of the trace. However this empirical estimation may lead to inaccurate modeling results especially when the stripline is not vertically symmetrical or the differences among the roughness levels of planes are significant. In this project, a methodology is presented to calculate the resistance of a stripline with different surface roughness levels on upper and lower sides of the trace and reference planes. After separating the resistances contributed by different smooth planes, each plane's resistance is corrected independently using corresponding surface roughness correction factor. The stripline's resistance is obtained by combining the corrected resistances of different planes.

Recommended Citation

S. Yong and V. Khilkevich and Y. Liu and J. He and H. Gao and S. Hinaga and D. Padilla and D. Yanagawa and J. Fan and J. L. Drewniak, "Resistance Modeling for Striplines with Different Surface Roughness on the Planes," Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, pp. 340 - 345, Institute of Electrical and Electronics Engineers (IEEE), Sep 2020.

The definitive version is available at https://doi.org/10.1109/EMCSI38923.2020.9191465

Meeting Name

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)

Department(s)

Electrical and Computer Engineering

Comments

National Science Foundation, Grant IIP-1916535

Keywords and Phrases

Printed Circuit Boards; Signal Integrity; Skin Effect; Striplines; Surface Roughness

International Standard Book Number (ISBN)

978-172817430-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

10 Sep 2020