A Cross-Sectional Profile based Model for Stripline Conductor Surface Roughness
Abstract
As the data rate of high-speed digital systems is getting higher, the conductor loss can no more be modeled assuming perfectly smooth conductor surfaces for even the smoothest foils available. The Huray model, based on the analytical calculation of the additional loss due to the scattering/absorption from conductive spheres on a smooth plane, has been presented to account for this issue. However, in practice it is very difficult to determine the parameters of the model. A modeling approach relating the parameters of the model to the conductor roughness profiles is needed. In this paper an investigation of the scattering by metal hemispheres, including their interaction, is performed. A method is brought up to estimate the multi-level physical model's parameters using the scanning electron microscope (SEM) or optical cross-sectional profile imaging. Accurate modeling of the frequency-dependent conductor loss is achieved.
Recommended Citation
S. Yong and V. Khilkevich and Y. Liu and R. He and Y. Guo and H. Gao and S. Hinaga and D. Padilla and D. Yanagawa and J. Fan and J. L. Drewniak, "A Cross-Sectional Profile based Model for Stripline Conductor Surface Roughness," Proceedings of the 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, pp. 334 - 339, Institute of Electrical and Electronics Engineers (IEEE), Sep 2020.
The definitive version is available at https://doi.org/10.1109/EMCSI38923.2020.9191620
Meeting Name
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity, EMCSI 2020 (2020: Jul. 27-31, Virtual)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Printed Circuit Boards; Signal Integrity; Skin Effect; Striplines; Surface Roughness
International Standard Book Number (ISBN)
978-172817430-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
10 Sep 2020
Comments
National Science Foundation, Grant IIP-1916535