Power Delivery Network Optimization Approach using an Innovative Hybrid Target Impedance
Abstract
A well-designed power delivery network (PDN) demands a set of efficient and effective modeling and optimization methodology for the Chip-Package-PCB System. This paper work provided and validated the hybrid target impedance for the PDN impedance optimization in frequency domain and the physics-based equivalent circuit model with small signal model for voltage response validation in time domain. The hybrid target impedance defined with current profile-based discrete and continuous target impedance. Two key impedance points in discrete were identified for on-chip worst case switching scenario and voltage regulator module switching ripple, more points can be added if specific core power switching scenario identified. The continuous impedance points are from the conventional target impedance by voltage ripple to dynamic current change. This hybrid method provides a more effective and convergent way to perform system level decoupling capacitors optimization in frequency domain and to meet voltage specification in time domain, also to avoid overdesigning for cost saving.
Recommended Citation
J. Xu et al., "Power Delivery Network Optimization Approach using an Innovative Hybrid Target Impedance," Proceedings of the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2019, New Orleans, LA), pp. 211 - 216, Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/ISEMC.2019.8825309
Meeting Name
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Chip Power Model; CPM; PCB; PDN; PI; Power Delivery Network; Power Integrity; Target Impedance; VRM
International Standard Book Number (ISBN)
978-153869199-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019