Title

Investigation of Electrostatic Discharge-Induced Soft-Failure using 3D Robotic Scanning

Abstract

A robotic ESD scanning system is presented for scanning complex 3D objects. It provides pseudo-2D plots that illustrate the sensitive locations of the device under test on a relative scale. Using this system, we could determine the susceptible regions of the device. It was observed that disturbing different sensitive regions lead to different soft-failure types. Determining the sensitive locations of a complex-shaped DUT helps to identify the disturbed circuitry and verify the effect of countermeasures in a repeatable way.

Meeting Name

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Comments

This material is based upon work supported by the National Science Foundation (NSF) under Grants IIP-1440110.

Keywords and Phrases

Electrostatic Discharge; Robot; Soft-Failure; System Level ESD

International Standard Book Number (ISBN)

978-153869199-1

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2019

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