Investigation of Electrostatic Discharge-Induced Soft-Failure using 3D Robotic Scanning
Abstract
A robotic ESD scanning system is presented for scanning complex 3D objects. It provides pseudo-2D plots that illustrate the sensitive locations of the device under test on a relative scale. Using this system, we could determine the susceptible regions of the device. It was observed that disturbing different sensitive regions lead to different soft-failure types. Determining the sensitive locations of a complex-shaped DUT helps to identify the disturbed circuitry and verify the effect of countermeasures in a repeatable way.
Recommended Citation
O. H. Izadi et al., "Investigation of Electrostatic Discharge-Induced Soft-Failure using 3D Robotic Scanning," Proceedings of the 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (2019, New Orleans, LA), pp. 173 - 177, Institute of Electrical and Electronics Engineers (IEEE), Jul 2019.
The definitive version is available at https://doi.org/10.1109/ISEMC.2019.8825248
Meeting Name
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019 (2019: Jul. 22-26, New Orleans, LA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electrostatic Discharge; Robot; Soft-Failure; System Level ESD
International Standard Book Number (ISBN)
978-153869199-1
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2019 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2019
Comments
This material is based upon work supported by the National Science Foundation (NSF) under Grants IIP-1440110.