Title

System-Level Design for ESD Protection on Multiple IO Interfaces

Abstract

This paper introduces the application of system-efficient ESD design (SEED) to ESD-induced pulses that are typical for system-level ESD. Emphasis is given to USB connectors because it has been shown that discharges to the connector shell will not lead to damaging current levels; however, the current levels are sufficient to cause soft-failures and possibly lead to latch-up of the USB IC.

Meeting Name

2018 IEEE International Reliability Physics Symposium, 2018 IRPS (2018: Mar. 11-15, Burlingame, CA)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

SPICE; Electro-Static Discharge (ESD); Snapback; SPICE modeling; System-efficient ESD design (SEED); Transient voltage suppressors (TVS); Electrostatic devices; Electrostatic discharge (ESD)

International Standard Book Number (ISBN)

978-1-5386-5479-8

International Standard Serial Number (ISSN)

1541-7026

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Mar 2018

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