Prediction of Worst-Case Radiation Immunity in Cable Harnesses
Abstract
Radio frequency immunity standards (e.g., RTCA/DO-160G, RTCA/DO-160F) require determining the differential voltage across shielded wires of cable harnesses placed over the metal plate. Due to the external radiation from the antenna, common mode currents are induced on the shields of wires. Through the shield imperfections the outer common mode is converted to the inner common mode of the harness, which in turn is converted to the differential mode. The presented work proposes the equivalent circuit model and methodology for prediction of the worst-case envelope for differential mode signals induced in cable harnesses placed over a ground plane. The induced signals are calculated using the circuit simulation avoiding the need for any 3D calculations. Experimental measurements validate the results.
Recommended Citation
D. Nozadze et al., "Prediction of Worst-Case Radiation Immunity in Cable Harnesses," Proceedings of the 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (2018, Long Beach, CA), Institute of Electrical and Electronics Engineers (IEEE), Aug 2018.
The definitive version is available at https://doi.org/10.1109/EMCSI.2018.8495182
Meeting Name
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity, EMC, SI and PI 2018 (2018: Jul. 30-Aug. 3, Long Beach, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Antennas; Busbars; Cables; Circuit simulation; Electromagnetic shielding; Equivalent circuits; Forecasting; Plate metal; Radiation shielding, Cable harness; Differential voltage; Induced signal; Radiation immunity; Shielding effectiveness, Electromagnetic compatibility
International Standard Book Number (ISBN)
978-153866621-0
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2018
Comments
This material is based upon work supported by the National Science Foundation (NSF) under Grants IIP-1440110.