Microwave Characterization of 3D Printed Conductive Composite Materials
Abstract
Effective electromagnetic shielding is important for reducing unwanted electromagnetic radiation from high frequency circuits. Recently, electrically conductive (carbon-based) polymer composites have been considered as a viable alternative to traditional electromagnetic interference (EMI) shielding materials due to their light weight, corrosion resistance and ease and flexibility of processing (i.e., three-dimensional/3D printing techniques). As such, in order to be able to take advantage of these benefits, the dielectric properties of these materials at microwave frequencies must be known. To this end, this work considers a set of 3D printed (3-layer) samples consisting of 2 solid outer layers, and an internal mesh layer (with triangular and honeycomb mesh features) with varying polymer volume content. Dielectric measurements were made in the X-band (8.2-12.4 GHz) for the samples with and without the cover layers. The results show that conductive polymers used for 3D printed structures have high potential as another option for EMI shielding structures.
Recommended Citation
Z. Manzoor et al., "Microwave Characterization of 3D Printed Conductive Composite Materials," Proceedings of the 2018 IEEE International Instrumentation and Measurement Technology Conference (2018, Houston, TX), Institute of Electrical and Electronics Engineers (IEEE), May 2018.
The definitive version is available at https://doi.org/10.1109/I2MTC.2018.8409627
Meeting Name
2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, I2MTC 2018 (2018: May 14-17, Houston, TX)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
3D Printing; Conductive Polymer Composites; Electromangetic Interference (EMI); Electromangetic Interference Shielding; Microwave Materials Characterization
International Standard Book Number (ISBN)
978-153862222-3
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2018