"Differential Signal Via Shield with Narrow Via Pitch Partial Electroma" by Chulsoon Hwang, Minchul Shin et al.
 

Differential Signal Via Shield with Narrow Via Pitch Partial Electromagnetic Bandgap Structure

Abstract

This paper presents a signal via shielding method in a printed circuit board with the narrow via pitch partial electromagnetic bandgap (NVP-PEBG) structure. The NVP-PEBG structure was developed to shield a small area such as a signal via with wideband isolation and compact size. This NVP-PEBG structure showed excellent noise isolation for a single-ended signal via. In this paper, the NVP-PEBG structure is applied to a differential signal via and its performance with the differential signal via is demonstrated in coupling against the noise in a power and ground plane.

Meeting Name

2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010 (2010: Jul. 25-30, Fort Lauderdale, FL)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Electromagnetic Compatibility; Electromagnetism; Electronic Equipment Manufacture; Energy Gap; Metamaterials; Printed Circuit Boards; Radiation Protection

International Standard Book Number (ISBN)

978-142446305-3

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2010 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2010

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