On-Chip Sensors to Measure Level of Transient Events
Abstract
On-die circuits were developed to measure the size of transient electrical events experienced at I/O pads. The circuits allow an integrated circuit (IC) to determine the peak voltages across the electrostatic discharge diodes during the event. Experiments and simulations with a 90 nm test chip show the sensor can determine the peak magnitude of the transient event within 1 A for events larger than 0.7 A and duration longer than 1 ns.
Recommended Citation
A. Patnaik et al., "On-Chip Sensors to Measure Level of Transient Events," Proceedings of the 39th Electrical Overstress/Electrostatic Discharge Symposium (2017, Tucson, AZ), Institute of Electrical and Electronics Engineers (IEEE), Sep 2017.
The definitive version is available at https://doi.org/10.23919/EOSESD.2017.8073459
Meeting Name
39th Electrical Overstress/Electrostatic Discharge Symposium, EOS/ESD (2017: Sep. 10-14, Tucson, AZ)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Voltage Measurement; Electrostatic Discharges; Transient Analysis; Integrated Circuit Modeling; Capacitors; Detectors
International Standard Book Number (ISBN)
978-1-58537-293-5
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2017 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Sep 2017
