A Simple Miniature Ultra-Wide Band Magnetic Field Probe Design for Magnetic Near-Field Measurements
Abstract
A simple miniature magnetic-field probe for near-field measurements in 9 kHz ~ 20 GHz bandwidth, which is applied to high-speed circuits, has been proposed and manufactured. The magnetic-field probe is built on a four-layer printed circuit board (PCB) using high-performance and low-loss Rogers material (εr =3.48 and tan δ =0.0037). Electric field coupling can be suppressed by PCB shielding structure of the magnetic-field probe. Coax-thru-hole via array technique is used to achieve impedance match. The resonance in working frequency band is suppressed through via fence, making |S21| rather smooth in the operation band. Experimental results show that the working frequency band is up to 9 kHz ~ 20 GHz.
Recommended Citation
Z. Yan et al., "A Simple Miniature Ultra-Wide Band Magnetic Field Probe Design for Magnetic Near-Field Measurements," IEEE Transactions on Antennas and Propagation, vol. 64, no. 12, pp. 5459 - 5465, Institute of Electrical and Electronics Engineers (IEEE), Dec 2016.
The definitive version is available at https://doi.org/10.1109/TAP.2016.2606556
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Electric fields; Fences; Frequency bands; Impedance matching (electric); Magnetic fields; Magnetism; Printed circuit boards; Probes; Reconfigurable hardware; Ultra-wideband (UWB); Electric-field coupling; High speed circuit; Magnetic field probe; Magnetic near-field measurement; Near-field measurement; Printed circuit boards (PCB); Via arrays; Via fence; Magnetic circuits; coax-thru-hole via array; Ultra-wideband magnetic-field probe
International Standard Serial Number (ISSN)
0018-926X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Dec 2016