Characterization and models for multi-gigabit signaling is an important issue in modern digital system. A good physical based model relies on a precise characterization of the test board. Typically, the characterization of the test board is associated with scattering matrix parameter measurement, which can be done with a VNA (Vector Network Analyzer) in the frequency-domain or a TDR (Time Domain Reflectometer) in the time-domain. The commonly used launch techniques on PCBs (Printed Circuit Boards) associated with the VNA or TDR measurement in the microwave frequency range use SMA or 3.5 mm connectors, in edge-launch or vertical-launch fashions. The transition between the launch port and the DUT (Device Under Test) introduces errors in the measurement. Embedding/deembedding techniques are used to remove the port influences in the measurement generally. For example, TRL (Through, Reflect, and Line) calibration is the typical method used in measurement to eliminate port influences. However, extra test kits are needed for TRL calibration, and furthermore the TRL calibration is sometimes difficult to implement, such as in coupled differential lines. In this paper, an effective hybrid approach for transmission line characterization is proposed, which includes choosing a suitable port launch technique for the test board, port parasitic parameters estimation, and building up a proper circuit model for evaluation with genetic algorithms (GA).
J. Zhang et al., "A Hybrid Approach to Decrease Port Influence in Transmission Line Characterization," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2005, Chicago, IL), vol. 3, pp. 684 - 689, Institute of Electrical and Electronics Engineers (IEEE), Aug 2005.
The definitive version is available at https://doi.org/10.1109/ISEMC.2005.1513611
IEEE International Symposium on Electromagnetic Compatibility (2005: Aug. 8-12, Chicago, IL)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
PCB; Device Under Test; Digital System; Frequency-Domain; Frequency-Domain Analysis; Genetic Algorithms; Microwave Frequency Range; Multi-Gigabit Signaling; Port Parasitic Parameters Estimation; Printed Circuit Boards; Printed Circuit Testing; Scattering Matrix Parameter Measurement; Through Reflect And Line Calibration; Time Domain Reflectometer; Time-Domain Analysis; Transmission Line Characterization; Transmission Lines; Vector Network Analyzer; Genetic Algorithm; Lossy Transmission Line Characterization; Parasitic Parameter Estimation; Port Launch Technique; Signal Integrity; TDR Measurement; VNA Measurement
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Aug 2005