Doctoral Dissertations
Keywords and Phrases
Electromagnetic Interference; Electrostatic discharge; Signal Integrity
Abstract
"Three-dimensional integrated circuits (3DICs) are becoming increasingly popular in high-speed electrical systems. 3DICs are made by stacking multiple dies vertically and connecting them with through-silicon vias (TSVs). In this dissertation, three studies were carried out to model the performance of 3DICs in extreme working conditions and the signal integrity (SI) performance of 3DICs.
First, an in-house Monte Carlo particle simulator was developed to characterize extreme working conditions (ESD/EMP) for ICs at the microscopic level instead of the macroscopic level. The ability of the simulator was demonstrated by modeling a voltage regulator diode under forward and reverse bias. The diode simulation results were validated by comparing them with the datasheet and measurement results.
Second, a time-efficient method was proposed to calculate the S-parameters and effective characteristic impedance of a transmission line referenced to a meshed return plane using 2D analysis. This method accounted for the periodic change of the structure and position-dependent current flow direction. This approach improves the design of weaved reference ground by providing a more time-efficient way to evaluate their electrical performance.
Lastly, in order to analyze the additional loss introduced by surface roughness of conductors on chip, interposer, and PCB, a novel method was presented for extracting the roughness level of conductor foils using only measured S-parameters and cross-sectional information. This method offers a simpler and more cost-effective alternative to optical or scanning electron microscope techniques" -- Abstract, p. iii
Advisor(s)
Kim, DongHyun (Bill)
Committee Member(s)
Beetner, Daryl G.
Hwang, Chulsoon
Fan, Jun, 1971-
Park, Jonghyun
Department(s)
Electrical and Computer Engineering
Degree Name
Ph. D. in Electrical Engineering
Publisher
Missouri University of Science and Technology
Publication Date
Summer 2024
Pagination
xii, 71 pages
Note about bibliography
Includes_bibliographical_references_(pages 20, 44 & 66)
Rights
©2024 Ze Sun , All Rights Reserved
Document Type
Dissertation - Open Access
File Type
text
Language
English
Thesis Number
T 12435
Electronic OCLC #
1478162208
Recommended Citation
Sun, Ze, "Semiconductor Physics based Signal Integrity Analysis for 3d Ic" (2024). Doctoral Dissertations. 3319.
https://scholarsmine.mst.edu/doctoral_dissertations/3319