Abstract
The plasma polymerization of tetrafluoroethylene (TFE) is studied in a capacitively coupled system with internal electrodes using a 10 kHz (af) and a 60 Hz (ac) source. The emphasis is on identifying conditions that are compatible with continuous coating of plasma polymer on a substrate moving through the center of the interelectrode gap. Operation at a pressure below 100 mTorr is most favorable for deposition of a substantial portion of the plasma polymer on this substrate. Plasma polymer deposited in this way is characterized by ESCA and by deposition rate data and compared to that deposited using rf power in both capacitively and inductively coupled systems. The polymers found in all systems are broadly similar and completely different from conventional poly(TFE). The distribution of power density in the various systems has been identified and compared. This is accomplished by using the known susceptibility of fluorine‐containing polymers (including plasma polymer) to a high‐power plasma as a probe of plasma power density within the interelectrode gap in the capacitively coupled system. The most active zone of the af or ac plasma is close to the electrode at a plasma pressure of approximately 40 mTorr. The use of a magnetic field leads to an intense localized glow such that etching by active fluorine atoms occurs at a specific locus on the electrode. By contrast, the low‐pressure rf capacitively coupled glow discharge is the mildest of those investigated, and its most active zone is further from the electrode and much more diffusely localized by a magnetic field. Copyright © 1979 John Wiley & Sons, Inc.
Recommended Citation
N. C. Morosoff et al., "Plasma Polymerization Of Tetrafluoroethylene. III. Capacitive Audio Frequency (10 KHz) And AC Discharge," Journal of Applied Polymer Science, vol. 23, no. 12, pp. 3471 - 3488, Wiley, Jan 1979.
The definitive version is available at https://doi.org/10.1002/app.1979.070231204
Department(s)
Chemical and Biochemical Engineering
Second Department
Chemistry
Publication Status
Full Access
International Standard Serial Number (ISSN)
1097-4628; 0021-8995
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2023 Wiley, All rights reserved.
Publication Date
01 Jan 1979